Trends, Collaboration Networks, and Research Impact in Thermal Management of Electronic Devices Using Passive Cooling Technique

Abstract

Thermal management of electronic devices (TMED) has gained attention the worldwide trend of automating processes employing artificial intelligence approaches. Unless efficient thermal management improvements and products that can withstand increased heat loads in small areas are introduced to the market, this field will continue to advance.  This study's goal is to provide a bibliometric analysis of passive cooling methods for electronic device thermal management using Scopus publishing records from the previous 25 years. a combination of best-performing nations, content and language types, author collaboration and citations, the study examines the article.  Authors cooperation and concurrences, as well as keyword-based and country-wise network analysis, can be observed using the VoS viewer program. The analysis clearly shows that China has the highest contribution (32%) in terms of publications, followed by the United States of America. The Scopus-indexed documents increased by 22 times during the period of 2000 to 2024 and a total of 616 documents received citations of 16563 in the year 2024 in the domain of TMED, which shows the growing interest of researchers. Future scholars will have a thorough understanding of how heat management in electronic equipment has changed over the previous 20 years thanks to the assembled study.